2008 Advance Program

2008

International Conference on
Compound Semiconductor
Manufacturing Technology

April 14 - 17, 2008

Register Online at
www.CSMANTECH.org

Westin Chicago North Shore,
Wheeling, Illinois, U.S.A.

MESSAGE FROM THE CONFERENCE CHAIR:

And do as adversaries do in law,

Strive mightily, but eat and drink as friends.

- The Taming of the Shrew, Act i. Sc. 2

On behalf of the conference Technical Program Committee and Executive Committee, I invite you to attend our twenty-third International Conference on Compound Semiconductor Manufacturing Technology (CS ManTech 2008)!  For this premier annual conference, CS professionals from all over the world will gather on April 14 – 17, 2008 to strive mightily yet eat and drink as friends.  We will meet in the Chicago area for the first time in our long history.  The beautiful and newly-opened Westin Chicago North Shore will be the site of the conference, continuing our long tradition of holding our meeting at great venues in interesting places.

2007 was a tumultuous year in our industry, showing signs of growth again after some quieter years.  GaAs IC use has continued strong in cell phone handsets while expanding rapidly in WiFi applications.  GaN and SiC are also addressing burgeoning markets for high power RF electronics and optics.  But we also witnessed the industry consolidation that CS watchers have long been predicting, with all the uncertainties that accompany that.  We in the CS world are indeed living in interesting times.    Keeping up with all that is happening and why is one of the many great reasons to come to ManTech!

The 51 members of the technical program committee and 19 members of the Executive Committee represent 52 companies, government agencies, and universities from all around the world.  Starting immediately after last year’s conference in Austin, Texas, they have worked to put together a world class technical program including 18 invited and 62 contributed papers from 67 of the top companies, research institutions, and universities in the CS world.  Business and technological issues related to all aspects of volume manufacturing of GaAs, GaN, SiC, and other compound semiconductors for electronic, optical, and optoelectronic applications are included in a solid three days of Presentations and Rump Sessions.

In addition, an all-star cast of speakers will give tutorial Workshop presentations on five great topics during the afternoon prior to the conference start.  This starts later than usual to allow attendees to travel to Chicago Monday morning.  And of course our popular and extensive Exhibits and Exhibitors’ Forum will feature suppliers of all our critical materials, wafers, fab tools, and foundry and analytical services.    They will be on-hand an extra half-day this year to bring you up to date on the latest developments in the rapidly evolving CS supply chains.

ManTech is also famous for its social and networking events and this year will be no exception.  From the Exhibits Reception Monday evening till the Closing Reception on Thursday, there are a large number of informal gatherings perfect for catching up with old friends and making new ones, for networking with colleagues from all over the world, and for just enjoying being part of the CS community.  The big event this year promises to be our International Reception, which for the first time will feature hands-on indoor race car driving for all interested attendees.  Racing and other interesting diversions are sure to make this an occasion to remember!

We all face many of the same challenges and so there is always much to talk about!  And in the collegial atmosphere that we strive for, we can all enjoy learning from each other without “giving away the store.”  This is sure to be a conference to remember, so make plans now to come to Chicago and be a part of it.  I hope to see you there!

Marty Brophy
TriQuint Semiconductor
Conference Chair
2008 International Conference on
Compound Semiconductor Manufacturing Technology
 

2008 CONFERENCE SPONSORS
(partial list, as of January 22, 2008)

MANTECH is an independent not-for-profit organization whose mission is to promote technical discussion and scientific education in the compound semiconductor manufacturing industry. The continued success of the conference is enabled by donations from corporate sponsors. The 2008 MANTECH Conference Committee gratefully acknowledges the support from our sponsors.

RF Micro Devices

MAX International Engineering Group

Cree

Skyworks Solutions

Aixtron

Freiberger Compound Materials

TriQuint Semiconductor

Oerlikon

OKI

Sumitomo Electric

Northrop Grumman

Anadigics

M/A-Com

 CS MANTECH works to support
the compound semiconductor industry
in cooperation with
The Japan Society of Applied Physics

2008 MEDIA SPONSORS

Semiconductor Today

Compound Semiconductor Magazine

Yole Développement – Micronews

Semiconductor International

 CompoundSemi Online

Small Times 

LED Journal

2007 CORPORATE SPONSORS

We would again like to thank our 2007 sponsors.

Booz Allen Hamilton

Skyworks

MAX International Engineering Group

Tegal

Oki

Hitachi Cable

Picogiga

Freiberger

Sumitomo Electric

Northrop Grumman

TriQuint Semiconductor

ST Systems

Anadigics

AXT

2008 CONFERENCE HIGHLIGHTS  (Back to Conference at a Glance)
The 2008 CS MANTECH program begins on Monday April 14^th with a series of tutorial Workshops from 1 to 6 p.m. Workshops will be in parallel sessions, and attendees can choose to attend 3 of the 90 minute workshops.

When the workshops end, go directly to the exhibit hall.  The Exhibits open at 6 p.m. with the annual reception…the best industry networking event of the year!    

The Conference formally opens Tuesday morning with a brief overview and awards for the best papers from the 2007 conference.  After the conference opening, we will begin our extended Plenary Session.  Speakers from Motorola, Peregrine Semiconductor, and RF Micro Devices talk about business and technical trends in electronics that are enabling our increasingly wireless world.  We then have three speakers who drive research that will shape our future.  The commercial, government, and the academic research communities will all be represented as we will hear from Intel, DARPA, and the University of Illinois.  With the conference in Illinois for the first time, it is fitting that our extended plenary begins and ends with Illinois-based Motorola and the University of Illinois, both of whom are central to the past, present, and future of compound semiconductors.

After lunch in the exhibits hall, Tuesday afternoon will feature applications-focused papers, both electronic and optoelectronic. Three papers in the electronic area will cover GaAs power switches, the frontier of terahertz electronics, and an innovative approach to hetero-integration: systems in a foil.  After an innovative coffee break (a MANTECH first: an Irish coffee break!) we will hear from speakers about compound semiconductors penetrating general lighting applications with white light, and the white-hot topic of solar energy.  The final hour of presentations on Tuesday will feature parallel presentations from industry suppliers – our Exhibitors’ Forum.  We will move out of the Westin on Tuesday evening for a hands-on driving experience:  Chicago Indoor Racing!

Wednesday and Thursday are packed with technical papers on compound semiconductor manufacturing technology. With many papers and limited time, we will distribute box lunches on Wednesday and Thursday.  For those wishing to maximize their exposure to the broad range of topics presented, there is no need to stop for lunch!  Even those prone to self-abuse will not be able to see everything, as Wednesday again features parallel sessions.  With parallel sessions, a short lunch break, and rump sessions into the evening, the day has a new name – No Mercy Wednesday. One side of Wednesday’s parallel sessions focuses on emerging wide bandgap technologies, while the other side covers the process, yield, device, and reliability topics for which CS MANTECH is well known.

Wednesday evening features the popular Rump Sessions.  Eat, drink, and debate!  Attendees may join any of the four parallel topics, where moderators will encourage informal and highly interactive discussions.  

Thursday morning continues with excellent technical papers on devices, circuits, and manufacturing.  At the lunch hour we have another CS MANTECH first:  An Hour with Industry Analysts.  Grab a box lunch and hear three market analysts present their take on what’s happening in the compound semiconductor industry!  Thursday afternoon is our Interactive Forum poster session.  The session includes papers on a diverse range of topics, as well as posters of all the papers presented earlier in the technical program.  Attendees have an excellent opportunity to meet with authors to discuss their papers.

WORKSHOPS (Back to Conference at a Glance)
Workshop attendees can improve their understanding of various fields, as industry and university experts share their   knowledge and hands-on experience.  Parallel sessions will be offered, covering the history of compound semiconductors, gallium nitride technology, fundamental III-N device physics, power amplifier modules, and solar cells.  For the latest schedule, please see our web site www.csmantech.org.

Our workshops will begin with “GaN Technology” by Dr. Umesh Mishra of the University of California, Santa Barbara.  AlGaN/GaN HEMTs are emerging as a preferred technology for a variety of applications ranging in frequency from microwave and mm-wave amplifiers to high voltage power switching.  These applications demand that devices have different designs as the trade-offs are application specific.  In this workshop/short course, the evolution of device design will be addressed and the baseline device including SiN passivation and field plates for field mitigation will be discussed in detail.  Devices for high voltage switching power applications will then be reviewed.  These will include vertical device structures such as the Current Apertured Vertical Electron Transistor (CAVET).  Lastly, new designs such as deep-recessed structures with reduced need for passivation will be discussed.

Our next workshop will be presented by Dr. Jerry Woodall, “Compound Semiconductor Materials and Devices:  How We Got Here and Where We Might Be Going”.  This workshop will review how compound semiconductor materials and devices evolved.  Dr. Woodall will focus on the roles of heterojunctions and the challenge of solving surface and interface issues in this continuing success story.  He will also cover nanotechnology and the potential for developments over the coming decades.

Dr. Michael Shur will delve into the device physics of compound semiconductor’s newest technologies: “Physics of III-N-based Field Effect Transistors”.  This workshop will discuss how wurtzite (hexagonal) symmetry makes the device physics of GaN/AlN/InN heterostructure field effect transistors (HFETs) quite different from more conventional GaAs/InAs/InP & Si FETs. Polarization at AlGaN/GaN and AlGaInN/InGaN interfaces leads to the formation of two-dimensional (2D) electron gas with concentrations 10 to 20 times higher than more conventional FETs, with enhanced electron mobilities but a reduced peak velocity.  Quantum well designs have been used to control the electron transfer from the 2D channel into adjacent layers.  High electric fields at the gate edges lead to an additional strain and hot electron effects causing current collapse and gate lag.  Large electron densities in the HFET channels minimize 1/f noise, making it even smaller than for highly doped GaN films. This device physics necessitates new approaches to device design.  Inverted HFET devices are expected to have a reduced access resistance, a larger current carrying capability, lower gate leakage, and better thermal control.  Insulated gate heterostructure field effect transistors demonstrated superior performance and reliability.  Field plates, recessed and double-recessed gates, and drain field controlled electrodes have been used to control current collapse and improve device reliability. Power and RF switching applications of III-N based transistors have emerged to take advantage of superior current carrying capabilities and low access resistance.

Dr. Steve Eglash from Cyrium Technologies will give a tutorial on “Opportunities in III-V Semiconductor Solar Cells”.  The diversity of solar energy solutions includes technologies such as high-concentration photovoltaics using compound semiconductor devices, thin-film silicon, CdTe, CIGS, and third-generation technologies such as organic PV and multiple exciton generation materials, as well as solar thermal technologies. 

This workshop will focus on systems using multi-junction cells and will answer questions such as:  Why have certain designs and architectures been chosen?  What is the competitive landscape?  This workshop will also address the technology and economics of multi-junction cells including cost, performance, design, and device physics.  Manufacturing issues and opportunities will be explored including similarities and differences between III-V PV and other III-V devices such as HBLEDs and GaAs ICs.  We will examine manufacturing models and cost drivers.

Ken Weller is our speaker for “Power Amplifier Modules.”  Digital modulation schemes have evolved from the "constant envelope" GMSK technique applied for GSM to complex, multi-channel, code-domain-multiplexed methods used in CDMA2000 and WCDMA systems. Although more complex modulation schemes facilitate wireless packet switched data services analogous to today's wired internet, linearity requirements imposed on the components making up the transmit chain in the handset radio become much more stringent.  This workshop first reviews motivation and basic concepts behind modern digital modulation techniques as applied to cellular networks.  Metrics and the ramifications of evolution toward more complex modulation schemes will be discussed, with a focus on the power amplification function.  This will lead into a survey of power amplifier approaches taken to meet various application requirements. The workshop will conclude with a prognosis of the challenges that will be imposed on handset RF component vendors as services migrate to "3G" and "4G" in the future.

INDUSTRY EXHIBITS  (Back to Conference at a Glance)

At 6 p.m., when the Workshops end, the Exhibition opens.  Monday evening’s Exhibits Reception is simply the best networking opportunity in our industry.  Everyone is there, food is provided, the bar is open, and no one drives home.  Exhibits will stay open all day on Tuesday, beginning with continental breakfast at 7 a.m.  On Tuesday we have extended coffee breaks and our buffet style Exhibits Lunch (12 p.m. -1:30 p.m.) in the exhibits area.  Attendees have ample opportunity to greet old friends and meet new ones.  This year, for the first time, the exhibits will stay open on Wednesday from 7 a.m. until 1 p.m.  This additional half-day is scheduled to allow for discussion with Exhibitors following presentations at the Tuesday afternoon Exhibitors’ forum (see below).

MANTECH’s exhibits provide an opportunity for device manufacturers to see suppliers of equipment, materials, and other services in a single location.  Industry suppliers have long known that MANTECH’s exhibition is the best opportunity of the year to congregate with the key players in the compound semiconductor industry.        

Those who know reserve their booth space early.  The exhibits often sell out, so you would be wise to book your space now.  Visit our web site at www.csmantech.org, and click on the Exhibitors link.  For any questions please contact Scott Sheppard, Exhibits Chair, 919-313-5549

email:  exhibitor@gaasmantech.org

EXHIBITS FORUM (Back to Conference at a Glance)

The exhibitors’ forum allows participating companies to introduce new products or highlight company strengths in a short presentation.  This year’s forum will be on Tuesday from 4:30 p.m. – 5:30 p.m.  There will be parallel sessions to maximize the number companies that can participate.   With the extended exhibit hours on Wednesday, attendees and exhibitors will have the opportunity for discussion after forum presentations.  Presentation slots can be requested when signing up for a booth.  Presentation slots are limited, so sign up early! 

INTERNATIONAL RECEPTION  (Back to Conference at a Glance)

MANTECH extends an invitation to family and friends to join us at this special event Tuesday night at Chicago Indoor Racing.  The facility contains two indoor race tracks featuring Bowman Race Karts that reach 35 m.p.h.  The reception will be held in a room with a view of the  race tracks.  Dinner will feature an “All Chicago” menu, a full bar, and multiple gaming areas.  So prepare for a fun evening of action!  Racers have to be 18 and hold a valid drivers license.  C.I.R has a zero tolerance for alcohol for racing, so race early – drink late.  Guest tickets are $50 each.  Purchase guest tickets at the time of your registration to ensure space at the reception!!

2007 BEST PAPER AWARDS (Back to Conference at a Glance)

CS MANTECH recognizes the authors of the best paper and best student paper of the previous conference, as determined from conference attendee votes tallied from feedback forms. Awards will be presented during the conference opening on Tuesday, April 15.

Authors of the Best Paper receive the He Bong Kim award, named in honor of Dr. He Bong Kim, founder of the International Conference on Compound Semiconductor Manufacturing Technology.  The He Bong Kim award winners for the 2007 conference are T.S. Low, K.W. Alt, R.E. Yeats, C.P. Hutchinson, D.K. Kuhn, M. Iwamoto, M.E. Adamski, R.L. Shimon, T.E. Shirley, M. Bonse, F.G. Kellert, and D.C. D’Avanzo of Agilent Technologies, Inc.; A. Wibowo, S. Hassler, N. Pan, and G. Hillier of MicroLink Devices, Inc.; and H. Badawi, M. Young, and W. Liu of AXT, Inc. for their paper “The Role of Substrate Dislocations in Causing Infant Failures in High Complexity InGaP/GaAs HBT ICs.”

Two papers are recognized as co-winners of the 2007 Best Student Paper. They are “Development of Simple Electrolytes for the Electrodeposition and Electrophoretic Deposition of Pb-free, Sn-based Alloy Solder Films,” authored by Chunfen Han, Qi Liu, and Douglas Ivey of the University of Alberta, and “AlGaN/GaN High Electron Mobility Transistors and Diodes Fabricated on Large Area Silicon on Poly-SiC (SopSiC) Substrates for Lower Cost and Higher Yield,” authored by Travis J. Anderson, F. Ren, L. Voss, M. Hlad, B.P. Gila, S.J. Pearton, J. Kim, and J. Lin of the University of Florida; and P. Bove, H. Lahreche, J. Thuret, and R Langer of PicoGiga International.  The principle student authors of these two papers, Chunfen Han and T.J. Anderson, will each receive a special cash award of $1000. Congratulations to these winning teams for their fine work!

SEMI STANDARDS MEETING  (Back to Conference at a Glance)

The SEMI Standards meeting is scheduled for Wednesday, April 16, from 7 p.m. to 9 p.m. for those interested in  standards for wafer specifications.  Topics being addressed are GaAs, InP, and SiC mechanical and electrical properties, epitaxial layer specifications, and non-destructive test methods.  Contact Russ Kremer  (russ@fcm-us.com), Jim Oliver (j.oliver@ngc.com) or Ian McLeod (imcleod@semi.org) for more information.

CONFERENCE CLOSING RECEPTION (Back to Conference at a Glance)

The conference ends Thursday afternoon with a Closing Reception.  During the Interactive Forum, conference attendees will vote for best poster.  The winning author will receive CS MANTECH’s Best Poster Award.   We will also hold our Feedback Form Raffle for a Blu-Ray DVD player.  Your Feedback Forms are very valuable in structuring future conferences and choosing best paper awards.  You need not be present to win.

2008 EXECUTIVE COMMITTEE

Conference Chair
Marty Brophy, TriQuint Semiconductor

Secretary
Jon Abrokwah, Freescale Semiconductor

Treasurer
Monte Drinkwine, Tyco Electronics

Publications and Technical Program Chair
Scott Davis, Sumitomo Electric  

Registration and Local Arrangements Chair
Steve Mahon, TriQuint Semiconductor.

Workshop Chair
Mike Barsky, Northrop Grumman

Publicity Chair
Michelle Bourke, Surface Technology Systems

Exhibits Chair
Scott Sheppard, Cree

Web Chair
David Via, Air Force Research Laboratory 

University Liaison
Heather Knoedler, Skyworks Solutions

Local Arrangements Vice-Chair
Russell Kremer, Freiberger Compound Materials

Sponsorship
Oded Tal, MAX IEG

European Liaison
Paul Cooke, IQE

Asian Liaison
Yohei Otoki, Hitachi Cable.

Executive Advisory Board
Jim Sewell, Air Force Research Laboratory
George Henry, Northrop Grumman

Executive Committee Members

Celicia Della-Morrow, Sumika Electronic Materials
Pat Fowler, Anadigics
Karen Renaldo, Northrop Grumman

MANTECH Support

Lucky Leong, Certified Public Accountant
Lucky Gold, Conference Services
Lynn Fincher, Webmaster
Margaret Doyle, Executive Assistant

TECHNICAL PROGRAM COMMITTEE

TECHNICAL PROGRAM