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A. Kleinwechter, T. Bünger, T. Flade, M. Jurisch, A. Köhler U. Kretzer, A. Seidl, B. Weinert Freiberger Compound Materials GmbH A simple biaxial stress test has been used to evaluate breakage behaviour of LEC and VGF wafers as well as the influence of laser marking on breakage.
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