The Study of
Dendrites Formation Mechanism to Enhance Gold Plating Process Yield,
Throughput, and Solution Lifetime
S.J. Huang, H.C.
Chou, T.C. Lee, B. Lin, D.W. Tu, P.C. Chao, and C.S. Wu
WIN Semiconductors
Corporation
No.69, Technology
E-mail: kevinh@winfoundry.com
Abstract
Two factors, Au content of
the plating bath and the duty cycle ratio of pulse plating, were studied to
improve the dendrite phenomenon of backside Au plating process. Dendrites
formation shortens the bath lifetime, and has a potential risk of yield loss at
the subsequent process steps. Dendrite phenomenon was improved significantly
and effectively with a higher duty cycle ratio, and could be eliminated
completely by DC plating.