Use of Chemical Mechanical Polishing for Planarization of GaAs
Integrated Circuits

Michael Meeder, Jeff Vass, Chuck Duncan, Walter Wohlmuth, Mike Fresina, and Curt Barratt
RF Micro Devices, Inc. 7628 Thorndike Rd. Greensboro, NC 27409.
Email: mmeeder@rfmd.com, Phone: 336-678-8295
Keywords: planarized, slurry, polishing, erosion, conditioner
Abstract
An interlayer dielectric process for GaAs is demonstrated in this paper. The interlayer dielectric process uses CMP for planarization of a PECVD dielectric. This paper explains GaAs CMP processing and the advantages of using a planarized PECVD interlayer dielectric.
 
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