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Chair: David Via, Air Force Research Laboratory |
MONDAY,May 18, 2009
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8:45 AM |
Welcome/Introductions |
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9:00AM |
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Moving from Reliability to Manufacturability
Bill Roesch
TriQuint Semiconductor |
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10:30 AM |
Break |
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10:45
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Failure Analysis – Fault Localization
Kevin Berger
Analytical Solutions, Inc. |
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11:45 AM |
Lunch |
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12:45 PM |
Transmission Electron Microscopy Based
Failure Analysis
Mike Salmon
Evans Analytical Group |
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1:45 PM |
Electrical, Thermal and Environmental
Reliability of Transistors: Experimental Techniques to
Identify Fundamental Degradation Mechanisms
Professor Jesus del Alamo,
Massachusetts Institute of Technology |
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2:45 PM |
Break |
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3:00 PM |
Fully Coupled Process and Device Simulation
for Understanding Reliability
Professor Mark Law,
University of Florida |
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4:00 PM |
Modern Thermography for Semiconductor
Technology for Reliability Testing: Channel Temperature and
Stresses/Strains in Devices
Professor Martin Kuball,
University of Bristol |
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5:00 PM |
End of Program |
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Copyright 2009 CSMantech All rights reserved |
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